Guangdong, China
Business Range:
Chemicals, Computer Products, Construction & Decoration, Electrical & Electronics, ...
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Management System Certification:
ISO 9001, ISO 9000, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001, ISO/TS 16949, QC 080000
Terms of Payment:
T/T, PayPal, Small-amount payment
OEM/ODM Availability:
OEM/ODM Service
Sample Available

PCB, Tg180, Control Impedance manufacturer / supplier in China, offering Tg180 HDI Blind Buried BGA Control Impedance PCB, Control Handheld PCBA Supplier, Fr4 Double Sided Layer PCB and so on.

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Tg180 HDI Blind Buried BGA Control Impedance PCB

Get Latest Price
Min. Order / Reference FOB Price
1 Piece US $10/ Piece
Port: Shenzhen, China
Production Capacity: 1000000/Year
Payment Terms: T/T, Paypal
Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Application: Communication
Flame Retardant Properties: HB
Mechanical Rigid: Rigid

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Basic Info

Model NO.: FD-TG180
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Brand: LD
Specification: 100X100MM
Origin: China
HS Code: 8534001000

Product Description

Product Description
TG180 HDI Rogers4003C control impedanceTg180 HDI Blind Buried BGA Control Impedance PCB

1. PCB, pcba, pcb design
3. Fast delivery with quality assured
4. ISO9001 certificate
5. Smt Pick And Place Pcb Assembly

1. PCB gerber file.
3. Send us your sample pcb board or PCBA.

One-stop pcb assemblies service, We can offer 1 to 12 Layer PCB fabrication, PCB design, PCB layout, PCB manufacturing, PCB Assemblies, components sourcing, PCBA Function Test, design solution

Tg180 HDI Blind Buried BGA Control Impedance PCB

Rigid PCB Capability
No.ItemTechnical data
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax600*1000mm (24"x40")
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical) 0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288  degrees centigrade & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, Blue, Black, White
18 White, Black, Yellow
19 4mil(0.1mm)
20 0.05mm
21 ±0.1
22Outline Tolerance±0.10mm (4mil)
23Surface FinishHASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

Tg180 HDI Blind Buried BGA Control Impedance PCB


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